New Senior Director of Business Development joins Ventec US-Team
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Ventec International Group Co., Ltd. announces the appointment of Paul Cooke as Senior Director of Business Development. With a holistic focus across the entire US region, Paul will further develop Ventec’s customer base in all key industry segments, including the core automotive, military, and aerospace sectors. Driven by the growing demand for Ventec’s products, as Sr. Director Business Development, Paul will also expand our US team with experienced individuals who provide exceptional customer solutions.
Paul comes to Ventec with 30 years of combined sales and engineering experience as a leading field application engineer in the PCB and electronics industries. An expert in both client and internal team relations, he has a comprehensive history in developing customer-led solutions, as well as a strong focus on training and industry education. Paul is a leader with several PCB standards organizations, including IPC, HDPUG and SMTA.
Chris Hanson, Global Head IMS Technology at Ventec comments: “Paul has extensive experience within the aerospace and military markets among others, and we’re enthusiastic to have him on board to grow our North American and Canadian client base.”
Andy Shaughnessy, Design007 Magazine
Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation! This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about?
Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.
I-Connect007 Editorial Team
Summit Interconnect’s Gerry Partida recently spoke with the I-Connect007 Editorial Team about his research into root causes of weak microvias. Rather than a single manufacturing process cause, Gerry suggests that microvia reliability is the culmination of several material interactions and that contrary to popular belief, microvias can still be stacked in small, tight packaging densities. He highlights the need for simulation, as well as some of his findings that he plans to publish in a paper at IPC APEX EXPO 2023.